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          RK3399

          RK3399 is a low power, high performance processor for computing, personal mobile internet devices and other smart device applications.
          型號:RK3399
          品牌:ROCKCHIP
          封裝:FCBGA828
          批號:17+
          庫存:600

          規格書(Datesheet):RK3399.PDF 點擊下載

          商品信息

           

                RK3399 is a low power, high performance processor for computing, personal mobile internet  devices and other smart device applications. Based on Big.Little architecture, it integrates dual-core Cortex-A72and quad-core Cortex-A53 with separate NEON coprocessor.(點擊即可咨詢芯片詳細信息
           
          RK3399’s Features
          1、 Microprocessor
          l - Dual-core ARM Cortex-A72 MPCore processor and Quad-core ARM Cortex-A53 MPCore
          processor, both are high-performance, low-power and cached application processor
          l - Two CPU clusters. Big cluster with dual-core Cortex-A72 is optimized for high-performance and little cluster with quad-core Cortex-A53 is optimized for low power.
          l - Full implementation of the ARM architecture v8-A instruction set, ARM Neon Advanced
          SIMD (single instruction, multiple data) support for accelerating media and signal processing
          l - ARMv8 Cryptography Extensions.
          l - SCU ensures memory coherency between the MPCore for each cluster.
          l - TCCI500 ensures the memory coherency between the two clusters
          - Each Cortex-A72 integrates 48KB L1 instruction cache and 32KB L1 data cache with 4-way set associative. Each Cortex A53 integrates 32KB L1 instruction cache and 32kB L1 data cache separately with 4-way set associative
          l - 1MB unified L2 Cache for Big cluster, 512KB unified L2 Cache for Little cluster.
          l - Trustzone technology support
          - Full Coresight debug solution
          l - Eight separate power domains for CPU core system to support internal power switch and externally turn on/off based on different application scenario
           
          2、Memory Organization
          l - Internal on-chip memory
          l - External off-chip memory
          3、 Internal Memory
          l - Internal BootRom
          l - Internal SRAM
          4、External Memory or Storage device
          l - Dynamic Memory Interface (DDR3/DDR3L/LPDDR2/LPDDR3)
          from various vendor
          l - eMMC Interface
          l - SD/MMC Interface
          5、System Component
          l - Cortex-M0
          - CRU (clock & reset unit)
          l - PMU
          l - Timer
          - PWM
          l - WatchDog
          - MailBox
          l - Bus Architecture
          l - Interrupt Controller
          l - DMAC
          l - Security system
          6、Video CODEC
          l - Embedded memory management unit(MMU)
          l - Video Decoder
          l - Video Encoder
          7、 JPEG CODEC
          l - JPEG decoder
          8、Image Enhancement (IEP module)
          l - Image pre-processor
          l - Video stabilization
          l - Image Post-Processor(embedded inside video decoder)
          - Image Enhancement-Processor (IEP)
          9、 Graphics Engine
          -3D Graphics Engine
          -2D Graphics Enginel-
          10、 Video IN/OUT
          l - Camera Interface
          - Image Signal Processer
          - Display Interface
          - Video Output Processor(VOP_BIG)
          - Write back
          - Embedded memory management unit(MMU)
          11、 HDMI
          - Single Physical Layer PHY with support for HDMI 1.4 and 2.0 operation
          - Link controller flexible interface with 30-, 60- or 120-bit SDR data access
          - Support HDCP 1.4/2.2
          12、MIPI PHY
          -Embedded 3 MIPI PHY, MIPI0 only for DSI, MIPI1 for DSI or CSI, MIPI2 only for CSI
          -Lane operation ranging from 80 Mbps to 1.5 Gbps in forward direction
          -Each port have 4 data lane, providing up to 6.0 Gbps data rate
          -Support 1080p@60fps output with single channel
          -Support 2560x1600@60fps output with MIPI0 and MIPI1 dual channel
          13、eDP PHY
          -Compliant with eDPTM Specification, version 1.3
          -Support RGB 6/8/10bit video format
          -Up to 4 physical lanes of 2.7/1.62 Gbps/lane
          -Support VESA DMT and CVT timing standards
          -Fully support EIA/CEA-861Dvideo timing and Info Frame structure
          -Hot plug and unplug detection and link status monitor
          -Supports Panel Self Refresh(PSR)
          14、DisplayPort
          -Compliant with DisplayPort Specification, version 1.2
          -Compliant with HDCP2.2 (and back compatible with HDCP1.3)
          -There is only one DisplayPort controller built-in RK3399 which is shared by 2 Type-C
          interface
          -25-600Mhz pixel clock
          -Supports 8/10 bpp RGB,YCbCr422,YCbCr420formats
          -Supports up to 4kx2k at 60Hz resolution
          -Variety of audio formatsPCM and compressed, over I2S or SPDIF interfaces
          -1Mbps AUX channel
          15、TYPE-C Interface
          - Embedded 2 Type-C PHY
          - Compliant with USB Type-C Specification, revision 1.1
          - Compliant with USB Power Delivery Specification, revision 2.0
          - Attach/detach detection and signaling as DFP, UFP and DRP
          - Plug orientation/cable twist detection
          - Enable/disable VBUS as DFP and DRP(when operating as DFP)
          - VBUS detection as UFP and DRP(when operating as UFP)
          - USB Power Delivery communication across the CC wire
          - Support USB3.0 Type-C and DisplayPort 1.2 Alt Mode on USB Type-C. Two PMA TX-only
          lanes and two PMA half-duplex TX/RX lanes(can be configured as TX-only or RX-only)
          - Up to 5Gbps data rate for USB3.0
          - Up to 5.4Gbps(HBR2) data rate for DP1.2, can support 1/2/4 lane mode
          - Support DisplayPort AUX channel
           
          16、 Audio Interface
          l - I2S0/I2S1 with 8ch
          l - I2S2/PCM with 2ch
          l - SPDIF
          17、 Connectivity
          l - SDIO interface
          l - GMAC 10/100/1000M Ethernet Controller
          l - SPI Controller
          l - UART Controller
          l - I2C controller
          l - GPIO
          l - USB OTG3.0
          18、USB 2.0 Host
          19、PCIe
          20、 Others
          l - Temperature Sensor(TS-ADC)
          -SAR-ADC(Successive Approximation Register)
          l - eFuse
          l - Package Type
          n BGA316 (body: 14mm x 14mm ; ball size : 0.3mm ; ball pitch : 0.65mm)
           
          RK3399’s Block Diagram
          RK3399's Block Diagram  
          RK3399’s Package
          RK3399's Package
          RK3399's Package
          RK3399’s Ordering Information

          RK3399's Ordering Information

          RK3399's Ordering Information

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