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        1. 當前位置:主頁 > 產品中心 > 主控芯片

          RK3368

          RK3368 is a low power, high performance octal-core Cortex-A53 processor for mobile phones
          型號:RK3368
          品牌:ROCKCHIP
          封裝:TFBGA453
          批號:15+
          庫存:700

          規格書(Datesheet):RK3368.PDF 點擊下載

          商品信息

                    RK3368 is a low power, high performance processor for mobile phones, personal mobile internet device and other digital multimedia applications, and integrates octal-core Cortex-A53 with separately NEON coprocessor. (點擊即可咨詢芯片詳細信息

          RK3368’s Features
          1、 MicroProcessor
          - Octal-core ARM Cortex-A53 MPCore processor, a high-performance,
          low-power and cached application processor
          - Two CPU clusters, with four CPU core for each cluster, One cluster is
          optimized for high-performance(big cluster) and the other is optimized for
          low power(little cluster)
          - Full implementation of the ARM architecture v8-A instruction set, ARM Neon
          Advanced SIMD (single instruction, multiple data) support for accelerated
          media and signal processing computation
          - ARMv8 Cryptography Extensions
          - In-order pipeline with symmetric dual-issue of most instructions.
          - Harvard Level 1 (L1) memory system with a Memory Management Unit
          (MMU).
          - Level 2 (L2) memory system providing cluster memory coherency, including
          an L2 cache.
          - Include VFP v3 hardware to support single and double-precision add,
          subtract, divide, multiply and accumulate, and square root operations
          - SCU ensures memory coherency between the four CPUs
          - CCI400 ensures the memory coherency between the two clusters
          - Integrated 32KB L1 instruction cache , 32KB L1 data cache with 4-way set
          associative
          - 512MB unified L2 Cache for big cluster, 256KB unified L2 Cache for little
          cluster
          - Trustzone technology support
          - Full coresight debug solution
          - Ten separate power domains for every core to support internal power switch
          and externally turn on/off based on different application scenario
          - One isolated voltage domain to support DVFS
          - Maximum frequency can be up to 900MHz@0.9V for Cortex-A53 big cluster
          - Maximum frequency can be up to 750MHz@0.9V for Cortex-A52 little
          cluster
          2、 Memory Organization
          - Internal on-chip memory
          - External off-chip memory①
          3、Internal Memory
          - Internal BootRom
          - Internal SRAM
          4、External Memory or Storage device
          - Dynamic Memory Interface (DDR3/DDR3L/LPDDR2/LPDDR3)
          - Nand Flash Interface
          - eMMC Interface
          - SD/MMC Interface
          5、System Component
          - CRU (clock & reset unit)
          - PMU(power management unit)
          - Timer
          - PWM
          - WatchDog
          - Bus Architecture
          - Interrupt Controller
          - DMAC
          - Security system
          6、 Video CODEC
          - Shared internal memory and bus interface for video decoder and encoder②
          - Embedded memory management unit(MMU)
          - Video Decoder
          - Video Encoder
          7、 HEVC Decoder
          - Main/Main10 HEVC/H.265 decoder
          - 4k@60FPS (core clock@300Mhz)
          - Support up to 4096x2304 resolution
          - Support up to 100Mbps bit rate
          - Embedded memory management unit(MMU)
          - Stream error detector (28 IDs)
          - Internal 128k cache for bandwidth reduction
          - Multi-clock domains and auto clock-gating design for power saving
          8、 JPEG CODEC
          - JPEG decoder
          - JPEG encoder
          9、 Image Enhancement
          - Image pre-processor
          - Video stabilization
          - Image Post-Processor (embedded inside video decoder)
          10、 Graphics Engine
          - 3D Graphics Engine :
          - Base handheld architecture fully Microsoft® DirectX™ 9.3, OpenGL®
          3.1, and OpenGL ES 3 compliant
          - Support for pull-model attribute evaluation
          - Tile-based deferred rendering architecture with concurrent processing
          of multiple tiles
          - Multi-threaded Unified Shading Cluster (USC) engine
          11、Video IN/OUT
          - Camera Interface(interface only)
          - Camera Interface and Image Processer(Interface and Image Processing)
          - Display Interface
          12、HDMI
          - Single Physical Layer PHY with support for HDMI 1.4 and 2.0 operation
          - Support HDCP 1.4
          - Support HDCP 2.2
          13、MIPI_DSI/LVDS/TTL combo PHY
          - MIPI_TX
          - LVDS
          - TTL
          14、MIPI_CSI PHY
          - Embedded one MIPI_CSI PHY
          - Support 4 data lane, providing up to 4Gbps data rate
          15、eDP PHY
          - Support 4Kx2K @ 30fps
          - Compliant with eDP TM Specification, version 1.1
          - Up to 4 physical lanes of 2.7/1.62 Gbps/lane(HBR2/HBR/RBR)
          - RGB, YCbCr 4:4:4, YCbCr 4:2:2 and 8/10/12 bit per component video format
          - Encoded bit stream (Dolby Digital, or DTS) – IEC61937 compliant
          - Support VESA DMT and CVT timing standards
          - Fully support EIA/CEA-861D video timing and Info Frame structure
          - Hot plug and unplug detection and link status monitor
          - Support DDC/CI and MCCS command transmission when the monitor
          includes a display controller.
          - Supports Panel Self Refresh(PSR)
          16、 Audio Interface
          - I2S/PCM with 8ch
          - I2S/PCM with 2ch
          - SPDIF
          17、 Connectivity
          - SDIO interface
          - High-speed ADC stream interface
          - TS interface
          - Smart Card
          - GMAC 10/100/1000M Ethernet Controller
          - SPI Controller
          - Uart Controller
          - I2C controller
          - GPIO
          - USB Host2.0
          - USB OTG2.0
          - HSIC Interface
          18、 Others
          - Temperature Sensor(TS-ADC)
          - SAR-ADC(Successive Approximation Register)
          - eFuse
          - Operation Temperature Range:-40C to +85C
          - Operation Voltage Range:Core supply: 1.0V (±10%) IO supply : 3.3V or 2.5V or 1.8V (±10%)
          - Process :GlobalFoundry 28nmSLP
          - Package Type
                            TFBGA453LD(body: 19mm x 19mm; ball size: 0.4mm; ball pitch:0.8mm)
           
          RK3368’s Block Diagram
           RK3368's Block Diagram
          RK3368’s Package

           RK3368's PackageRK3368's Package

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